USB 3.0 chip shipments to show 120% Compounded Annual Growth to 2015

lundi 14 février 2011

Jessie Shen, DIGITIMES, Taipei

With more SuperSpeed-enabled motherboards, notebooks and other PC peripherals hitting store shelves, shipments of USB 3.0 host and device controller chips worldwide will increase from 2010 to 2015 with a compound annual growth rate (CAGR) of 120%, according to Digitimes Research.

USB 3.0 can read data 10 times the speed of its 2.0 predecessor, allowing for a maximum data transfer rate of up to 4.8Gbps while improving power efficiency. The key strength addresses the need for future consumer products, said Nobunaga Chai, analyst for semiconductor at Digitimes Research.

As USB 3.0 controller prices go down at a gradual pace to near 2.0 chip prices, the next-generation interconnect technology will see its growing adoption among PCs, consumer electronics and mobile devices over the next several years, Chai indicated. The market for USB 3.0 device controllers is also expected to enter its fast growth stage.

Chai noted that both Intel’s and AMD’s technology roadmaps highlight their attention to support USB 3.0. Intel plans to launch its Chief River CPU platform that will come with native support of USB 3.0 in the first half of 2012. AMD will integrate USB 3.0 functions in its new platform series to be rolled out in 2011.

Chai predicted that the market for USB 3.0 device controllers will reach beyond PC and storage systems in 2012. Between 2013-2014, smartphones will ship with the interface enabled.